Svmuu News: Citrini analyst jukan posted on X, stating that South Korean media reports indicate China’s CXMT is currently testing a pilot bonding DRAM production line in Hefei, with the goal of achieving high-performance DRAM without using EUV lithography. Bonded DRAM is a technology in which the memory cell array and peripheral circuits are manufactured on separate wafers and then bonded together. This method allows for the production of ultra-high-density DRAM using only multi-patterning deep ultraviolet (DUV) lithography, without the need for EUV equipment.
Samsung Electronics is developing its own bonded DRAM under the “B1b” project, and SK hynix is also advancing similar technology. South Korean media warned that some assessments suggest CXMT may currently be ahead of its South Korean competitors in terms of both the technology itself and the pace of development.