Svmuu News: According to South Korean media reports, Samsung Electronics and SK Hynix are reevaluating the timeline for adopting hybrid bonding technology in next-generation High Bandwidth Memory (HBM). As the demand for reduced thickness and improved thermal performance in HBM has declined, the market anticipates that the introduction of this technology may be further delayed beyond previous expectations. Meanwhile, both companies are independently developing new thermal management solutions, such as HPB and iHBM, and plan to apply them to HBM5 products. However, industry observers believe that as the number of HBM I/O channels continues to increase in the future, hybrid bonding will remain a key technological path in the medium to long term.