Svmuu News: Chip manufacturer Tower Semiconductor announced on July 14 (local time) that it will invest $3 billion to expand its chip manufacturing operations in Japan, including a $1 billion grant from the Japanese government. According to the statement, the first phase will significantly increase production capacity for 300-millimeter silicon photonics devices, with full-scale production expected to begin in the fourth quarter of 2027. This phase involves retrofitting the former Fab 6 facility to enable production of 300-millimeter silicon photonics devices and advanced packaging capabilities. Phase two will begin simultaneously with phase one and will include the construction of a new 300-millimeter lithography equipment manufacturing facility adjacent to the Fab 7 plant.