Svmuu News: Citrini analyst jukan posted on X that Samsung Electronics plans to build a new DRAM wafer fab at its Giheung campus, converting a site originally intended for a R&D center into a memory production facility. The facility is expected to have a monthly production capacity of approximately 100,000 wafers, with a total investment estimated at hundreds of trillions of won. Samsung Electronics has formed an internal team to advance the construction of the new wafer fab, with initial construction set to begin as early as the third quarter. Counterpoint Research forecasts that, driven by rising product prices, global DRAM market revenue will grow from $150 billion this year to as high as $210 billion. Samsung Electronics is also installing a new production line with a monthly capacity of 100,000 wafers at its P4 plant in Pyeongtaek, capable of producing DRAM for sixth-generation HBM (HBM4), and plans to build a wafer fab in the next-generation semiconductor cluster in Yongin, Gyeonggi Province, with the goal of beginning initial production in 2029. In addition, the company is moving forward with the construction of two advanced semiconductor fabs at the Gwangju Semiconductor Cluster in South Jeolla Province, with a total investment of 400 trillion won.