Intel CFO David Zinsner stated at the Deutsche Bank Technology Conference on August 26 that the company will accelerate the construction of its Ohio wafer fab, aiming for completion in 2028 or 2029, and plans to convert some facilities in Oregon into high-volume production lines. Previously, Intel successfully raised $23 billion in equity in early August, with CEO Lip-Bu Tan personally subscribing to $12 million worth of shares.

Zinsner revealed that the newly raised funds will primarily be used to expand existing fabs, including Fab 34 in Ireland and Fab 52 and Fab 62 in Arizona, and to accelerate the construction of the Ohio fab, where Mod 1 and Mod 2 will cost approximately $28 billion. He also hinted that Intel has secured commitments from external customers for its 14A node and noted that its EMIB-T packaging technology is helping to win customers and cross-sell front-end foundry capabilities.