Svmuu News: Samsung Electronics’ Semiconductor Division recently established a BEOL process organization within the etching technology team of its Memory Business Division. The division plans to complete the setup this month and begin operations at the Pyeongtaek campus, with an initial staff of approximately 30 people.
Most members of this organization are senior engineers, and their discussions will focus on securing BEOL process technologies for high-value-added memory such as HBM, as well as strengthening staffing and supply chain operations.
BEOL refers to the metal interconnect formation process in the back-end of the semiconductor manufacturing process, used to connect individual devices and transmit signals after the wafer devices have been formed. Samsung Electronics began shipping HBM4 in the first half of this year, featuring 2,048 I/Os—double that of the previous generation.
Increasing the number of I/Os within a limited chip area requires denser wiring and narrower line widths, placing higher demands on the precision of metal interconnect formation and etching. The organization is still in its early stages of formation, and its specific operational direction and objectives will be clarified at a later date.