AMD CEO Lisa Su stated in her CES keynote that the next-generation AI chip, the MI455 GPU, is manufactured using 2-nanometer and 3-nanometer processes, features advanced packaging, and is equipped with HBM4. The MI455 GPU will be integrated with EPYC CPUs, and the next-generation Helios AI rack will contain 72 GPUs. By connecting thousands of Helios racks, large-scale AI clusters can be built. Additionally, the MI500 series of chips is currently in development and will utilize a 2-nanometer process. With the launch of the MI500 series in 2027, AMD aims to increase the performance of its AI chips by 1,000 times within four years. (Yicai)