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SemiAnalysis: SPHBM4 Shifts the Complex Engineering Burden of AI Chips to the Substrate Layer
Svmuu News: SemiAnalysis posted on X stating that the SPHBM4 shifts the complex engineering burden of AI chips. Chip manufacturers will no longer purchase extremely expensive proprietary “silicon interlayer + ABF substrate” combinations, but will instead shift entirely to purchasing extra-large, multi-layer ABF substrates—or adopt glass substrates earlier when performance demands are directly driven to the substrate level. The substrate boom has only just begun.
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Source：Odaily · Source Link
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