Svmuu News: South Korean semiconductor company Samsung Electronics is finalizing its investment plan for a large-scale semiconductor production base in South Korea, with plans to build four new wafer fabs by 2030, and has already shared the relevant plans with its major partners.
Samsung Electronics plans to build P5 and P6 in Pyeongtaek, as well as one wafer fab in the Namsi-eup semiconductor cluster in Yongin and a new wafer fab in Gwangju. SK Hynix is expected to build Y1 and Y2 in the Wonsam-myeon semiconductor cluster in Yongin and construct a new wafer fab in Gwangju; the two companies will build a total of seven new wafer fabs between now and 2030.
On the 29th of last month, Samsung Electronics and SK Hynix announced a semiconductor equipment investment roadmap totaling 3,200 trillion won, excluding investment costs for AI data centers. Samsung Electronics has moved up its target completion date for the Yongin wafer fab from 2047 to 2040, while SK Hynix has moved its target from 2045 to 2033.
Sources in the semiconductor equipment industry indicated that Samsung Electronics recently approached partners to gauge their interest in making additional investments in Gwangju, based on the premise of building a wafer fab there by 2030; however, given current production capacity and Gwangju’s infrastructure, it remains difficult to confirm the feasibility of this plan.