The Hong Kong Monetary Authority (HKMA) announced today that participating banks in the Intellectual Property (IP) Financing Sandbox have completed credit approvals for the first batch of seven pilot cases, covering industries such as electronics, construction, toy manufacturing, and medical equipment. Loan amounts range from HKD 1 million to HKD 39 million and will be used for working capital, business expansion, and market promotion. This initiative lays a practical foundation for Hong Kong's IP financing ecosystem.