The Hong Kong Monetary Authority (HKMA) announced today (October 21) the tender results for HK$0.75 billion of 3-year HKD institutional Government Bonds, issued under the Infrastructure Bond Programme. The tender received HK$3.537 billion in applications, resulting in a bid-to-cover ratio of 4.72. The average accepted price was 98.38, implying an annualised yield of 3.821%.