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AI Chip Packaging
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Samsung Electronics has opened an AI chip packaging R&D center in Yokohama, Japan, aiming to accelerate technological collaboration with Japanese suppliers.
The center, which opened on Tuesday, September 8, will focus on back-end chip manufacturing processes to leverage Japan's expertise in packaging equipment and materials such as adhesives and substrate
-
Samsung Electronics has opened an AI chip packaging R&D center in Yokohama, Japan, aiming to accelerate technological collaboration with Japanese suppliers.
The center, which opened on Tuesday, September 8, will focus on back-end chip manufacturing processes to leverage Japan's expertise in packaging equipment and materials such as adhesives and substrate
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AI Chip Packaging
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