Svmuu News: According to industry sources, on July 1, ASE, the world’s leading semiconductor packaging and testing (OSAT) provider, announced another increase in its packaging prices, with the highest price hike exceeding 20%.
The price increases announced by ASE this time cover various advanced packaging technologies, including Chip-on-Wafer-Substrate (CoWoS) and Fan-Out Chip-on-Substrate (FoCoS). (Jin Shi)
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Semiconductor packaging and testing leader ASE has once again raised its packaging prices, with increases of up to 20%.
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Disclaimer: This content reflects the author's personal views only and does not constitute investment advice.
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