Taiwan Semiconductor Manufacturing Co. (TSMC) is reportedly developing an advanced chip packaging technology, internally dubbed "EMIB Like," which is similar to Intel Corp.'s Embedded Multi-die Interconnect Bridge (EMIB). This move, in partnership with Taiwan's Kinsus Interconnect Technology, could challenge Intel's competitive advantage in advanced packaging. Intel's EMIB technology uses silicon bridges to connect multiple chip components, enhancing processor complexity and efficiency. The report also notes that Nvidia Corp. is evaluating Intel's EMIB for future processors. In pre-market trading, Intel's stock rose 4.62%, and TSMC's stock increased by 3.69%.