According to Bloomberg on August 15, a new type of off-balance-sheet guarantee structure called "Residual Value Guarantee" (RVG) has emerged in the AI chip financing boom, reaching a scale of $70 billion. Chip giants such as NVIDIA and Broadcom are leveraging their own credit to endorse customer financing, helping customers reduce borrowing costs. However, these contingent liabilities are not recorded on the companies' balance sheets, raising concerns in the bond market about pricing hidden risks. Moody's and S&P Global Ratings have issued warnings, stating that the increase in such contingent obligations could limit chip manufacturers' financial flexibility and put downward pressure on their credit profiles. Some investors believe that this financial engineering might be masking real risks, especially during market downturns, when these guarantees could convert into actual losses.