AMD plans to invest over $10 billion in Taiwan by 2029 for advanced chip packaging, chip substrates, and manufacturing capabilities for complete AI systems. This move aims to ensure that its rapidly growing demand for AI hardware can be met and to help partners expand production of next-generation products such as the Helios AI rack. The investment will benefit the broader Taiwanese semiconductor ecosystem, including TSMC, while AMD is also collaborating with companies like ASE Technology, Siliconware Precision Industries, and Powertech Technology to develop next-generation packaging technologies.