According to the Korean newspaper The Herald Business, SK Hynix plans to diversify its supplier base by entrusting Intel with the production of the Base Die for its high-bandwidth memory (HBM) starting as early as the seventh-generation HBM4E. Previously, TSMC was the sole manufacturer of these Base Dies. This move aims to reduce SK Hynix's reliance on TSMC and alleviate the pressure of continuously rising raw material costs. Industry sources indicate that the cost of HBM4 Base Dies produced by TSMC is 3 to 4 times higher than SK Hynix's own core chips. In response, SK Hynix stated that it is difficult to confirm details regarding the company's technology roadmap and that "some of the content is not consistent with the facts," without directly confirming the report.