Samsung Electronics has locked in approximately 70% of its High Bandwidth Memory (HBM) production capacity through long-term agreements until 2031.
Samsung Electronics has reportedly secured approximately 70% of its HBM production capacity through long-term agreements with major clients such as Microsoft, NVIDIA, and Google, with these agreements potentially extending until 2031. The agreed price is $300 to $400 per module, significantly lower than the spot market price of around $2,100. SK Hynix CEO warned that HBM shortages could persist until 2030, and the company has pledged to invest $38.3 billion by 2031 for HBM capacity expansion.
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