SK Hynix's silicon wafer procurement surged by 104% quarter-over-quarter in Q2 2026, significantly outpacing Samsung Electronics, to address AI memory inventory pressure and anticipated price hikes. According to DIGITIMES, this aggressive procurement strategy aims to mitigate future wafer price increases and ensure capacity release in high-bandwidth memory (HBM) and advanced DRAM markets. The company also raised its 1C DRAM expansion plans and intends to invest $4 billion in a next-generation HBM packaging plant in Indiana, USA, to support HBM4 production. Furthermore, SK Hynix has tacitly approved price increases of 3% to 4% from some core equipment suppliers, indicating the deepening reliance of memory giants on the upstream supply chain in the AI-driven capacity arms race.