HanmiGlobal to manage construction of SK hynix's Indiana advanced chip packaging plant through 2028
HanmiGlobal is overseeing construction of SK hynix's advanced chip packaging plant in Indiana, the project management firm said Monday, as Korean tech firms lean more heavily on specialized managers for their US expansions. The facility in West Lafayette, Indiana, will be SK hynix's first US production base for advanced packaging for high bandwidth memory chips. Site excavation began in March, with clean room completion targeted for October 2028. HanmiGlobal joined the project in August 2024.
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