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Taiwan's Powertech Technology plans to invest US$2.2 billion to build the world's first AI chip panel-level packaging factory, with production expected to begin as early as early 2027, potentially putting it ahead of TSMC.
Taiwan's Powertech Technology (PTI) announced plans to invest US$2.2 billion to establish the world's first AI chip panel-level packaging factory in Hsinchu, Taiwan, with production slated to begin as early as Q1 2027. This move aims to produce server CPUs, AI computing chips, and advanced optical devices, potentially giving PTI a lead over TSMC in next-generation AI chip packaging technology. AMD and Broadcom are likely to be among the first customers to adopt this technology.
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