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Taiwan's Powertech Technology plans to invest US$2.2 billion to build the world's first AI chip panel-level packaging factory, with production expected to begin as early as early 2027, potentially putting it ahead of TSMC.
Taiwan's Powertech Technology (PTI) announced plans to invest US$2.2 billion to establish the world's first AI chip panel-level packaging factory in Hsinchu, Taiwan, with production slated to begin as
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Taiwan's Powertech Technology plans to invest US$2.2 billion to build the world's first AI chip panel-level packaging factory, with production expected to begin as early as early 2027, potentially putting it ahead of TSMC.
Taiwan's Powertech Technology (PTI) announced plans to invest US$2.2 billion to establish the world's first AI chip panel-level packaging factory in Hsinchu, Taiwan, with production slated to begin as
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Powertech
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