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Micron plans to double its monthly HBM wafer production to 100,000 wafers by the end of the year, aiming to catch up with Samsung and SK Hynix.
According to industry sources cited by Yonhap News, Micron Technology plans to double its monthly High Bandwidth Memory (HBM) production capacity to approximately 100,000 wafers by the end of this year, compared to last year. This move aims to narrow the production gap with Samsung Electronics and SK Hynix, and accelerate the mass production of its latest-generation HBM4 12-layer products to meet the demand for NVIDIA's new AI accelerators. Currently, Micron holds an 18% share of the HBM market, while Samsung and SK Hynix have a monthly production capacity of approximately 150,000-200,000 wafers.
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