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South Korea's Samsung Electro-Mechanics and LG Innotek are strengthening their advanced semiconductor substrate capabilities, preparing for the next-generation AI packaging technology race.
South Korean chip substrate manufacturers Samsung Electro-Mechanics and LG Innotek are actively preparing for future shifts in the AI semiconductor packaging market. Currently, TSMC's CoWoS-L technology remains dominant, but South Korean companies are enhancing their capabilities in advanced semiconductor substrates, including solutions related to Intel's EMIB technology.
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