Taiwan Semiconductor Manufacturing (TSMC) is reportedly developing an advanced packaging technology that resembles Intel's Embedded Multi-die Interconnect Bridge (EMIB). This move appears to validate Intel's packaging approach, which uses small silicon bridges to connect chiplets, offering benefits like lower costs, improved yields, and support for larger package sizes.

While TSMC already dominates advanced packaging with its CoWoS technology, primarily used for high-bandwidth GPU training, the EMIB-like development suggests TSMC is addressing the growing customer demand for packaging flexibility, especially for cost-sensitive AI ASICs. Analysts note that this expansion is not an admission of CoWoS falling behind, but rather a recognition that the booming AI market requires diverse packaging solutions, with more competition expected to grow the overall market rather than redistribute ex