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CoWoS
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Citi, Nomura, UBS Research SEMICON Taiwan 2026: AI Semiconductor Expansion Shifts to Full Chain; UBS Raises TSMC CoWoS Capacity Forecast to 260K Wafers/Month; Nomura Points to CPO Testing as Mass Production Bottleneck
The continuous expansion of AI hashrate is driving the semiconductor expansion logic to extend from chip and wafer manufacturing to advanced packaging, optical interconnect, and testing. Surveys from
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TSMC executive says ABF substrates may become the second biggest bottleneck in advanced packaging, with the shortage in the coming years potentially second only to memory.
TSMC's Vice President of Advanced Packaging, Jun He, stated that as AI accelerator sizes and packaging complexity continue to increase, the demand for ABF substrates is being driven higher. Although T
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Taiwan Semiconductor Manufacturing (TSMC) Is Developing an Advanced Packaging Technology Similar to Intel's EMIB
Taiwan Semiconductor Manufacturing (TSMC) is reportedly developing an advanced packaging technology that resembles Intel's Embedded Multi-die Interconnect Bridge (EMIB). This move appears to validate
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Citi, Nomura, UBS Research SEMICON Taiwan 2026: AI Semiconductor Expansion Shifts to Full Chain; UBS Raises TSMC CoWoS Capacity Forecast to 260K Wafers/Month; Nomura Points to CPO Testing as Mass Production Bottleneck
The continuous expansion of AI hashrate is driving the semiconductor expansion logic to extend from chip and wafer manufacturing to advanced packaging, optical interconnect, and testing. Surveys from
-
TSMC executive says ABF substrates may become the second biggest bottleneck in advanced packaging, with the shortage in the coming years potentially second only to memory.
TSMC's Vice President of Advanced Packaging, Jun He, stated that as AI accelerator sizes and packaging complexity continue to increase, the demand for ABF substrates is being driven higher. Although T
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Taiwan Semiconductor Manufacturing (TSMC) Is Developing an Advanced Packaging Technology Similar to Intel's EMIB
Taiwan Semiconductor Manufacturing (TSMC) is reportedly developing an advanced packaging technology that resembles Intel's Embedded Multi-die Interconnect Bridge (EMIB). This move appears to validate
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