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CoWoS
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UBS has raised its CoWoS industry capacity forecast, expecting it to reach 270,000 wafers per month by the end of 2027, a significant 69% increase from 2026, driven by strong ASIC and CPU demand.
UBS noted in its latest research report that the demand for cloud AI chips continues to exceed expectations, driving the advanced packaging industry into a new expansion cycle. The report raised its f
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Citi, Nomura, UBS Research SEMICON Taiwan 2026: AI Semiconductor Expansion Shifts to Full Chain; UBS Raises TSMC CoWoS Capacity Forecast to 260K Wafers/Month; Nomura Points to CPO Testing as Mass Production Bottleneck
The continuous expansion of AI hashrate is driving the semiconductor expansion logic to extend from chip and wafer manufacturing to advanced packaging, optical interconnect, and testing. Surveys from
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TSMC executive says ABF substrates may become the second biggest bottleneck in advanced packaging, with the shortage in the coming years potentially second only to memory.
TSMC's Vice President of Advanced Packaging, Jun He, stated that as AI accelerator sizes and packaging complexity continue to increase, the demand for ABF substrates is being driven higher. Although T
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Taiwan Semiconductor Manufacturing (TSMC) Is Developing an Advanced Packaging Technology Similar to Intel's EMIB
Taiwan Semiconductor Manufacturing (TSMC) is reportedly developing an advanced packaging technology that resembles Intel's Embedded Multi-die Interconnect Bridge (EMIB). This move appears to validate
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UBS has raised its CoWoS industry capacity forecast, expecting it to reach 270,000 wafers per month by the end of 2027, a significant 69% increase from 2026, driven by strong ASIC and CPU demand.
UBS noted in its latest research report that the demand for cloud AI chips continues to exceed expectations, driving the advanced packaging industry into a new expansion cycle. The report raised its f
-
Citi, Nomura, UBS Research SEMICON Taiwan 2026: AI Semiconductor Expansion Shifts to Full Chain; UBS Raises TSMC CoWoS Capacity Forecast to 260K Wafers/Month; Nomura Points to CPO Testing as Mass Production Bottleneck
The continuous expansion of AI hashrate is driving the semiconductor expansion logic to extend from chip and wafer manufacturing to advanced packaging, optical interconnect, and testing. Surveys from
-
TSMC executive says ABF substrates may become the second biggest bottleneck in advanced packaging, with the shortage in the coming years potentially second only to memory.
TSMC's Vice President of Advanced Packaging, Jun He, stated that as AI accelerator sizes and packaging complexity continue to increase, the demand for ABF substrates is being driven higher. Although T
-
Taiwan Semiconductor Manufacturing (TSMC) Is Developing an Advanced Packaging Technology Similar to Intel's EMIB
Taiwan Semiconductor Manufacturing (TSMC) is reportedly developing an advanced packaging technology that resembles Intel's Embedded Multi-die Interconnect Bridge (EMIB). This move appears to validate
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CoWoS
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Samsung Electronics is down 4.44% from its previous close, now trading at ₩231,250.
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Samsung Electronics fell 5.99% from its previous close, now trading at ₩227,500.
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Cryptocurrency Investing for Beginners: A Guide to Buying and Asset Management
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Former Aptos advisor "Buzz" leaves project, shifts meme marketing efforts to Meta stock
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Nikkei Asia: Iranian separatists intensify attacks and seize territory in response to a potential full-scale US assault.
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President Trump returns to Ohio, highlighting over $100 billion in private investment attracted to the state during his term.
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A Boston office building was sold at a foreclosure auction for one-third of its 2019 price, representing a discount of approximately $546 million.
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The Federal Reserve maintained interest rates, with a 10-2 vote. Lisa Cook and Beth Hammack voted in favor of a rate hike.
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