On August 24, Xiaomi released three self-developed Xuanjie chips: the Xuanjie O3 SoC for flagship smartphones, the Xuanjie O100 high-bandwidth AI acceleration chip for edge large model computing, and the Xuanjie D100 high-hashrate chip for intelligent driving. Among them, the Xuanjie O3 adopts a 3nm process, integrates 24 billion transistors, and will be first equipped in the Xiaomi 18 Fold in September this year. Both the Xuanjie O100 and Xuanjie D100 are planned for official commercial use in 2027. The O100 uses a 6nm process, and the D100 uses a 3nm process, with a single chip supporting up to 160GB of memory.