Intel is extending its advanced packaging strategy to the Micro LED substrate field and is reportedly collaborating deeply with Taiwanese panel giant AUO to jointly advance CPO (Co-Packaged Optics) and high-density computing chip integration solutions, according to Taiwan's Economic Daily News on September 21. Intel has obtained a U.S. authorized patent named "IC Package with Micro LEDs," which involves embedding semiconductor chips into a glass substrate and achieving electrical interconnection between Micro LEDs and the packaging substrate through Through-Glass Vias (TGVs). AUO Chairman Paul Peng previously stated at an investor conference that the company has completed its layout in advanced packaging and glass substrates and is co-developing with partners. Analysts believe this move will provide Intel with differentiated competitive advantages in the AI computing packaging race and open a window for AUO to transform into high-value advanced packaging.