TSMC has reportedly decided to adjust wafer prices based on process technology starting January 2027, with increases ranging from approximately 3% to 6%, with advanced processes seeing higher hikes, according to Digitimes, citing supply chain sources. This round of price increases is primarily driven by the comprehensive expansion of chip demand fueled by AI data center buildouts and the high costs of overseas factory construction. Currently, TSMC's 8-inch fab utilization rate exceeds 100%, with processes below 45nm fully loaded, and order visibility extending to 2030. These price increases will directly raise customers' tape-out costs and will be transmitted progressively along the supply chain, putting pressure on other foundries like Samsung Electronics, Intel, and UMC, as well as IC design customers, to follow suit.