NVIDIA and Cisco jointly launched USFP, a new generation of ultra-high-density pluggable optical module standard, on October 12. The first product supports single-channel 400Gb/s electrical signals, increasing bandwidth density fourfold compared to existing solutions, marking a new phase in AI data center interconnect technology. The two companies will collaborate with TE Connectivity and Amphenol to build a hardware ecosystem and plan to advance USFP as an open industry specification through a community-led multi-source project to address interconnect bottlenecks caused by the expansion of AI factories.