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Samsung Electronics unveiled its next-generation AI data center memory strategy, including HBM5 and PIM technologies, at the OCP Summit.
Samsung Electronics on Tuesday outlined plans to enhance AI data center performance through faster memory, expanded capacity, and more efficient storage at the Open Compute Project Global Summit 2026 in San Jose, California. The company showcased its latest high-bandwidth memory, including 8th-generation HBM5, custom HBM solutions, and Processing-in-Memory (PIM) technology designed to accelerate data processing and improve energy efficiency.
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