According to the latest report from the Semiconductor Equipment and Materials International (SEMI), driven by capacity expansion from major manufacturers such as Intel, TSMC, Samsung, and Micron, 300mm fab equipment spending in the Americas is projected to more than double from $18.1 billion in 2026 to $40.6 billion in 2029. Global fab equipment spending is expected to jump from $113 billion in 2025 to approximately $149 billion in 2026, a year-over-year increase of 31%, and reach $227 billion by 2029. Clark Tseng, Senior Director at SEMI, emphasized at SEMICON West 2026 that this growth stems from continuous investment in advanced logic, advanced memory, and other 300mm wafer technologies, marking the official entry of the AI capital expenditure race into the phase of capacity realization and order fulfillment.