Bank of America Securities reported that NVIDIA confirmed the full-scale mass production of its Vera Rubin GPUs and CPUs at the GTC conference in Berlin on October 21. NVIDIA also announced deepened cooperation with key outsourced semiconductor assembly and test (OSAT) vendors, including ASE/SPIL, KYEC, and Amkor, involving a total investment exceeding $4 billion. This initiative aims to address the packaging and testing capacity bottlenecks in AI infrastructure development.

Specific collaborations include: an agreement with ASE/SPIL to increase optical engine (OE) capacity by 15 times by mid-2027 and double it again by the end of 2028; an $1.1 billion prepayment agreement with KYEC to support its new testing facility in the United States and expansion of its Singapore operations; and a $3 billion agreement with Amkor to increase interposer capacity in South Korea by over 300% by the end of 2028. NVIDIA is also accelerating the deployment of co-packaged optics (CPO), with demand for related equipment expected to see an inflection point in 2027, and diversifying the packaging sources for Vera CPUs to ASE.