According to a report by South Korean newspaper Maeil Business Newspaper on October 22, citing industry sources, Tesla and NVIDIA have jointly pledged to invest approximately 3.7 trillion Korean Won in Samsung Electro-Mechanics to secure advanced packaging substrate capacity for next-generation AI chips. Samsung Electro-Mechanics will use this investment to expand its flip-chip ball grid array (FC-BGA) substrate production lines, with the new lines expected to be completed by the end of 2027 and the first shipments to Tesla commencing in 2029.

Specifically, Tesla will invest approximately 1.1 trillion Korean Won and sign a five-year long-term supply agreement with Samsung Electro-Mechanics for FC-BGA substrates from 2029 to 2033, ensuring the supply of critical components for its autonomous driving AI chips and Optimus humanoid robots. NVIDIA's investment commitment to Samsung Electro-Mechanics is approximately 2.6 trillion Korean Won, aimed at securing a significant portion of Samsung Electro-Mechanics' annual packaging substrate capacity in 2028.

NVIDIA is also expanding its substrate supply chain globally, having signed a capacity prepayment agreement with Japan's Ibiden to support a threefold expansion of its Ono factory capacity, with new capacity expected to be released in the first quarter of 2028. In Taiwan, NVIDIA is supporting Unimicron Technology's expansion of KF substrate capacity through a capacity reservation agreement, with new output expected to begin in the second quarter of 2027.