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Leading enterprises in semiconductor packaging and testing, chip design, glass substrates, and advanced packaging equipment
The 24th China Semiconductor Packaging and Testing Technology and Market Annual Conference (referred to as the "Packaging and Testing Annual Conference") will be held in Nanjing from November 4-6. Leading enterprises in semiconductor packaging and testing, chip design, glass substrates, and advanced packaging equipment, including Huatian Technology, JCET Group, Tongfu Microelectronics, TSMC Nanjing, Biren Technology, BOE, and Yuntian Semiconductor, will exchange views on the latest developments in advanced packaging through the main forum, special reports, and supply-demand matchmaking.
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