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TSMC executive says ABF substrates may become the second biggest bottleneck in advanced packaging, with the shortage in the coming years potentially second only to memory.
TSMC's Vice President of Advanced Packaging, Jun He, stated that as AI accelerator sizes and packaging complexity continue to increase, the demand for ABF substrates is being driven higher. Although T
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TSMC executive says ABF substrates may become the second biggest bottleneck in advanced packaging, with the shortage in the coming years potentially second only to memory.
TSMC's Vice President of Advanced Packaging, Jun He, stated that as AI accelerator sizes and packaging complexity continue to increase, the demand for ABF substrates is being driven higher. Although T
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