TSMC's Vice President of Advanced Packaging, Jun He, stated that as AI accelerator sizes and packaging complexity continue to increase, the demand for ABF substrates is being driven higher. Although TSMC's CoWoS capacity has doubled for three consecutive years, and supply is "very close" to market demand, the bottleneck in advanced packaging is shifting from memory to substrate materials. He also revealed that TSMC's 5.5x reticle size CoWoS is already in mass production with a yield exceeding 98%; the 14x reticle solution is expected to be launched before 2029. Additionally, TSMC is accelerating the advancement of SoIC hybrid bonding technology, planning to reduce the pitch to 4.5 micrometers before 2029 and apply it to A14 chip stacking.