Huawei has advanced the launch of its Ascent 960DT AI chip by three quarters, with shipments expected in Q1 2027, coinciding with Chinese President Xi Jinping's first state visit to the United States in over a decade. Alibaba's chip division also unveiled the Zhenwu V900 chip, boasting three times the performance of its predecessor, slated for release in early 2027. These moves are seen as China sending a message to the US that its technological restrictions can slow, but not halt, China's AI development. Although US Treasury Secretary Scott Bessent and Trade Representative Greer have met with Chinese Vice Premier He Lifeng, the issue of advanced chip export controls was not on the agenda. Analysts note that while China is accelerating its development, US models still maintain a lead in technical benchmarks and profitability.