NVIDIA is collaborating with companies across the industry chain to advance the implementation of glass substrate technology, addressing the increasing physical limitations in AI chip packaging related to size, heat dissipation, and interconnection. German equipment manufacturer SCHMID disclosed that it is cooperating with core enterprises in the Intel, NVIDIA, and AMD supply chains to research and develop glass core substrate equipment. This technology is expected to support larger-scale HBM integration, enhancing the packaging density and data transmission capabilities of next-generation GPUs. However, technical obstacles still exist in the through-glass via (TGV) metallization process, and end-customer certification has not yet been completed.