The Samsung Electronics affiliate will expand its chip package substrate capacity in South Korea and Vietnam. Global customers are helping fund part of its new AI-server substrate capacity in Sejong and have committed to future volumes. The company will invest 4.27 trillion won ($3.2 billion) in its Sejong plant through May 2028 to expand production of flip chip-ball grid array (FC-BGA) substrates, which are used in AI accelerators.