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Nvidia's Rubin platform to favor 12-layer HBM4, as SK Hynix and Samsung advance 16-layer chips
Nvidia's Vera Rubin AI platform is expected to largely rely on 12-layer high-bandwidth memory (HBM4) chips. This development eases demand concerns for SK Hynix and Samsung Electronics, as the two Korean chipmakers are advancing 16-layer HBM4 technology amid growing challenges in advanced packaging. Market researcher Counterpoint Research stated on Friday that most Rubin-based products will likely use 12-layer HBM4, the sixth generation of high-bandwidth memory, rather than the previously rumored eight-layer configuration.
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