Sony Group and Taiwan Semiconductor Manufacturing Co. (TSMC) are forming a joint venture, with Sony holding approximately 60% and TSMC 40%, to mass-produce next-generation image sensor chips in Kumamoto, Japan, as early as 2029. The chips are intended for Apple's iPhone and future "physical AI" applications in robots and vehicles. The joint venture is expected to be established by the end of fiscal 2026 (through March 2027).