Bank of America Securities research team reported that at the 2026 AI Infrastructure Summit, major manufacturers and cloud computing giants including Micron, Samsung, SK Hynix, Broadcom, Marvell, Intel, Qualcomm, OpenAI, AWS, and Google collectively appeared, with core discussions highly focused on strategies to address the "memory wall" problem. All parties present generally agreed that the disaggregation of memory and storage has become the most widely accepted technical path. Qualcomm showcased its HBC solution, while SK Hynix introduced dedicated memory tiers such as PIM and HBF. The report emphasized that efficiency metrics are replacing computing power scale as the new industry benchmark, interconnect architectures are accelerating towards openness, and demand for customized chips is simultaneously rising.